2023@Taizhou

History 2023

Organized by Sichuan University, State Key Laboratory of Subtropical Building Science of South China University of Technology, and  IAEEEE, co-organized by the University of Science and Technology Beijing, Xi'an University of Architecture and Technology, Kunming University of Science and Technology, Shanghai Jiao Tong University, Zhejiang University, Southwest Jiaotong University, University of Electronic Science and Technology of China, Xiangtan University, Nano Materials Science, and Jiangsu Foundry Society, the 2023 2nd International Conference on Materials Science and Engineering(CoMSE 2023)has been held on July 21-July 23, 2023 in Taizhou, China.

On behalf of the organizing committee, we would like to express our sincere thanks to all the participants for their strong support in the preparation of this conference.


Conference Chairs:

Zidong Wang

University of Science and 

Technology Beijing, China

Sheng Han

Shanghai Institute of Technology

China

Haiyang Zou

Sichuan University

China


Jinbin Wang 

Xiangtan University

China

Jiangmiao Yu

South China University of Technology

China



Session Chairs


Prof. Haiyang Zou

Sichuan University

China

Prof. Sheng Han

Shanghai Institute of Technology

China



Prof. Jiangmiao Yu

South China University of Technology

China



Prof. Yanlin Wang

University of Science and Technology

Beijing


Keynote Speaker:


Prof. Yunbo Chen

Academician of Chinese Academy of Engineering

Prof. Zidong Wang

University of Science and Technology Beijing

Prof. Hong Xu

North University of China

Prof. Qingyan Xu

Tsinghua University


Onsite Participate:


Keynote Session:


Parallel Session


Award Ceremony

Best Paper Award:

Paper Title: Characteristics of welding laser beam and its influence on weld forming coefficient

Authors: Lijun Han, Lei Jia, Wenchao Yu

Affiliation:  FAW-Volkswagen automotive Company, LTD., Chang Chun, China


Paper Title: Strategies for strength-ductility optimization of FCC high entropy alloys

Authors: Mei Li and Yongfeng Shen

Affiliation: Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Material Science and Engineering, Northeastern University, Shenyang, China


Paper Title: Effect of specimen thickness on fatigue crack shape evolution for aluminum alloy

Authors: Liming Wu, Yuting He, Teng Zhang

Affiliation: Aviation Engineering School, Air Force Engineering University, Xi'an, China


Best Student Paper Award:

Paper Title: Transient liquid phase bonding of Sn-Pb solder with added Cu particles

Authors: Jiaxing Wang, Pengrong Lin, Quanbin Yao, Yinzhuo Huang, Xiaochen Xie, Zongyang Li, Long Zhang

Affiliation: NO.2.Siyingmen N.Rd. Donggaodi Fengtai District, Beijing, China


Outstanding Paper Award: 

Paper Title: Strategies for strength-ductility optimization of FCC high entropy alloys

Authors: Mei Li and Yongfeng Shen

Affiliation: Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Material Science and Engineering, Northeastern University, Shenyang, China


Paper Title: Effect of Al on the microstructure and properties of Cu-15Ni-8Sn alloy

Authors: Wei Luo, Lijun Peng, Qian Yu, Haofeng Xie and Xujun Mi

Affiliation: Youyan Engineering Technology Research Institute Co., Ltd.


Best Oral Presentation Award:

Paper Title: Surface Modified Materials for different Applications

Authors: Dandan Wang, Mark G. Moloney

Affiliation: Oxford Suzhou Centre for Advanced Research, Jiangsu, China


Best Poster Award

Paper Title: Wetting and interfacial phenomena between a Ni-based superalloy and silica-based ceramic cores with ZrSiO4 additions

Authors: Xiaoyan Chen, Zhihui Li,Yanjie Zhao,Chengkang Qi, Shurong Li, Fei Li

Affiliation:  Shanghai Jiaotong University




Coffee Break


Photo Session:


Specially Invited Guest:


Publication

2023 2nd International Conference on Materials Science and Engineering (CoMSE 2023) has been published by IOP JPCS(Journal of Physics: Conference Series, ISSN: 1742-6588, Volume: 2671).

Link: https://iopscience.iop.org/issue/1742-6596/2671/1