History 2023
Organized by Sichuan University, State Key Laboratory of Subtropical Building Science of South China University of Technology, and IAEEEE, co-organized by the University of Science and Technology Beijing, Xi'an University of Architecture and Technology, Kunming University of Science and Technology, Shanghai Jiao Tong University, Zhejiang University, Southwest Jiaotong University, University of Electronic Science and Technology of China, Xiangtan University, Nano Materials Science, and Jiangsu Foundry Society, the 2023 2nd International Conference on Materials Science and Engineering（CoMSE 2023）has been held on July 21-July 23, 2023 in Taizhou, China.
On behalf of the organizing committee, we would like to express our sincere thanks to all the participants for their strong support in the preparation of this conference.
Conference Chairs:
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Zidong Wang University of Science and Technology Beijing, China | Sheng Han Shanghai Institute of Technology China | Haiyang Zou Sichuan University China |
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Jinbin Wang Xiangtan University China | Jiangmiao Yu South China University of Technology China |
Session Chairs
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Prof. Haiyang Zou Sichuan University China | Prof. Sheng Han Shanghai Institute of Technology China | Prof. Jiangmiao Yu South China University of Technology China | Prof. Yanlin Wang University of Science and Technology Beijing |
Keynote Speaker:
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Prof. Yunbo Chen Academician of Chinese Academy of Engineering | Prof. Zidong Wang University of Science and Technology Beijing |
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Prof. Hong Xu North University of China | Prof. Qingyan Xu Tsinghua University |
Onsite Participate:
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Keynote Session:
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Parallel Session
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Award Ceremony
Best Paper Award:
Paper Title: Characteristics of welding laser beam and its influence on weld forming coefficient Authors: Lijun Han, Lei Jia, Wenchao Yu Affiliation: FAW-Volkswagen automotive Company, LTD., Chang Chun, China |
Paper Title: Strategies for strength-ductility optimization of FCC high entropy alloys Authors: Mei Li and Yongfeng Shen Affiliation: Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Material Science and Engineering, Northeastern University， Shenyang, China |
Paper Title: Effect of specimen thickness on fatigue crack shape evolution for aluminum alloy Authors: Liming Wu, Yuting He, Teng Zhang Affiliation: Aviation Engineering School, Air Force Engineering University, Xi'an, China |
Best Student Paper Award:
Paper Title: Transient liquid phase bonding of Sn-Pb solder with added Cu particles Authors: Jiaxing Wang, Pengrong Lin, Quanbin Yao, Yinzhuo Huang, Xiaochen Xie, Zongyang Li, Long Zhang Affiliation: NO.2.Siyingmen N.Rd. Donggaodi Fengtai District, Beijing, China |
Outstanding Paper Award:
Paper Title: Strategies for strength-ductility optimization of FCC high entropy alloys Authors: Mei Li and Yongfeng Shen Affiliation: Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Material Science and Engineering, Northeastern University， Shenyang, China |
Paper Title: Effect of Al on the microstructure and properties of Cu-15Ni-8Sn alloy Authors: Wei Luo, Lijun Peng, Qian Yu, Haofeng Xie and Xujun Mi Affiliation: Youyan Engineering Technology Research Institute Co., Ltd. |
Best Oral Presentation Award:
Paper Title: Surface Modified Materials for different Applications Authors: Dandan Wang, Mark G. Moloney Affiliation: Oxford Suzhou Centre for Advanced Research, Jiangsu, China |
Best Poster Award
Paper Title: Wetting and interfacial phenomena between a Ni-based superalloy and silica-based ceramic cores with ZrSiO4 additions Authors: Xiaoyan Chen, Zhihui Li,Yanjie Zhao,Chengkang Qi, Shurong Li, Fei Li Affiliation: Shanghai Jiaotong University |
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Coffee Break
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Photo Session:
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Specially Invited Guest:
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Publication
2023 2nd International Conference on Materials Science and Engineering (CoMSE 2023) has been published by IOP JPCS(Journal of Physics: Conference Series, ISSN: 1742-6596, Volume: 2671) and and indexed by Ei Compendex and other citation databases.
Link: https://iopscience.iop.org/issue/1742-6596/2671/1
