We are pleased to announce the 2023 International Conference on Materials Science and Engineering (CoMSE 2023) which will be held on March 24-26, 2023 in Shanghai, China. This conference dedicates itself to providing networking possibilities for researchers, scientists, engineers and scholars to share their experience, amazing ideas and innovative research in the field of materials science and engineering. In addition, this conference would also be a stand and to discuss practical issues, challenges encountered as well as the solutions adopted.
The material science and engineering research is undergoing a revolution as we head into Industry 4.0. Materials engineers are the ones who design and innovate new materials for applications and this has given rise to development of computer chips to biomedical devices to composites. With the advent of Industry 4.0, more expertise and research are needed in nanotechnology, automation and medical breakthroughs. The past materials engineers began with work on wood or ceramics but today, the focus is on biomaterials, sustainable materials, nanomaterials and advanced manufacturing.
The CoMSE 2023 committee is excited to invite authors and scholars from all over the world to be a part of this conference and share their innovative research progress with the academic and industrial world. We believe the conference would be an amazing platform to enhance our knowledge and create new ideas to help promote the advances and changes of the joint academic researches. The synergy between material scientists and engineers can create ideas which at one time may not have been possible.
CoMSE 2023 will be held in Shanghai, in southern China. The conference will begin on 24 March 2023 with registration and welcome reception followed by two days of knowledge sharing by scholars and students. Our conference will not be complete without the keynote addresses and plenary lectures by our prominent speakers.
We believe CoMSE 2023 will be an exceptional platform for knowledge sharing and also fortification of new collaborations in the field of materials science and engineering. As the world becomes borderless, research is becoming borderless as well. We wish you all the best and may you have a memorable conference and return home with scientifically recharged ideas and international collaborators.
On behalf of the organizing committee